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The process of semiconductor manufacturing has come a long way since its inception in the 1950s. From the initial intersection diffusion process, the semiconductor industry now employs complex manufacturing processes that require precision and accuracy. One such process is Ion Implantation and Subsequent Processing (ISP).
ISP is a process used by semiconductor manufacturers to precisely place ions into a semiconductor substrate. This implantation of ions into the substrate is then followed by post-implantation anneal and passivation processes to ensure that the ions are securely embedded and create the desired electrical properties in the silicon.
ISP is an extremely complex process that requires careful control of parameters such as ion species, implantation dose and time, substrate temperatures, anneal solutions, and so on. It is also a very expensive process which has led to it becoming a closely guarded secret of semiconductor manufacturers.
The main advantages of ISP are its accuracy and precision when it comes to implant shallow implants in high aspect ratio silicon substrates. Companies such as Intel and AMD rely heavily on ISP when manufacturing processors. Its accuracy makes it possible to achieve desired transistor characteristics and levels of performance.
ISP also has several drawbacks. Its complexity requires that trained professionals are well versed in the design and technology of the process. This makes it difficult for inexperienced manufacturers to employ the process effectively. Additionally, its cost is a significant drawback for many potential users.
In conclusion, ISP is a complex and expensive process used in semiconductor manufacturing. It provides manufacturers with the ability to precisely place ions into a semiconductor substrate, resulting in better transistor characteristics and improved performance. Its complexity can be a deterrent for those new to the process, but its advantages in terms of accuracy and precision are unrivalled.
