Research on Reasons for the Roughness of Copper Particle Internal Plating Plate
Abstract
The main purpose of this research is to analyze the reasons for the roughness of copper particle internal plating plate. Nowadays, copper particle internal plating is widely used in the manufacture of electronic products. It has excellent electrical conductivity and simple plating process. In order to improve the quality of products, it is necessary to investigate the reasons for the roughness of copper particle internal plating plate. After analysis, it is found that the reasons for the roughness of copper particle internal plating plate are related to the cleaning effect of the plating solution, the plating process and the quality of the copper particles. At the same time, countermeasures are put forward to guide the production process.
Keywords: Copper particle internal plating; Roughness; Reason; Countermeasure.
1 Introduction
With the continuous development of science and technology, copper particle internal plating plate has been widely used in the production of electronic products. Copper particle internal plating plate has the advantages of simple process and good electrical conductivity. It not only improves the quality of products, but also reduces the production cost. However, due to the poor control of copper particle internal plating plate and other uncontrollable factors, the surface of copper particle internal plating plate often shows the phenomenon of coarse grains. This will affect the appearance of the product and even affect the normal use effect of the product. Therefore, it is necessary to investigate and analyze the reasons for the roughness of copper particle internal plating plate, and find corresponding solutions according to different causes and effects.
2 Reasons for roughness
2.1 Inadequate cleaning effect of plating solution
The cleaning process of the plating solution is an important guarantee for the adhesion and uniformity of the plating layer. Improper cleaning will cause uneven plating layer and affect the product quality. If the base material is not cleaned thoroughly, there will be dust, oil stains and other contaminants left on the surface of the plate, which will cause the surface of the plate to be uneven and easily lead to the phenomenon of coarse grains, thus affecting the appearance and use effect of the product.
2.2 Plating process is not controlled well
In the plating process, poor process control will also cause the surface of plating plate to be rough, such as improper electrolyte concentration, selection of inappropriate current, improper temperature and insufficient plating time. These process factors will cause the plated layer to be uneven and coarse particles easily appear.
2.3 The quality of copper particles is not up to standard
The quality of copper particles affects the degree of adhesion of the plating layer and the flatness of the plating layer. The poor quality of the copper particles used in the production process can easily lead to the formation of uneven plating layer and then, the surface of the plate will appear coarse grains.
3 Countermeasures
3.1 Pay attention to the selection of plating solution
In the process of plate plating, we should pay attention to the selection of plating solution. The selected plating solution should have strong cleaning effect and not easy to cause pollution. At the same time, pay attention to the concentration control of the plating solution, do not exhaust too fast, and regularly replace and maintain the plating solution to keep it clean.
3.2 Control the plating process
In the process of copper particle internal plating, the various parameters should be strictly controlled. The current should be determined according to the plated parts and environmental temperature. The bath temperature should be controlled at 25～28℃. Plating time should also be strictly controlled according to the thickness of the plating layer requirements. Under normal circumstances, the thickness of the plating layer can be adjusted by changing the plating time.
3.3 Improve the quality of copper particles
The quality of copper particles should be improved by strict quality control. Select copper particles with the same size and shape to ensure the uniformity of copper particles. At the same time, clean copper particles should be selected to prevent the copper particles attached to dirt or oil affecting the adhesion of the plating layer.
4 Conclusion
The phenomenon of roughness of copper particle internal plating plate seriously affects the appearance and use effect of products. Through analysis and research, we found that the reasons for the roughness of copper particle internal plating plate are mainly related to the cleaning of the plating solution, the control of the plating process and the quality of the copper particles. In view of this, we proposed some corresponding countermeasures to guide the production process and improve the product quality. Through the above analysis, we can better understand the causes of roughness of copper particle internal plating plate and obtain effective solutions.
Reference
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[2] Cui Jingjing. Research on Surface Quality of Copper Particle Internal Plating[J]. Thin-plate Deep Drawing Technology, 2015, 23(6): 52-59.
[3] Chen Yanbo. Research on Quality Control of Copper Particle Internal Plating [J]. Electronic Technology, 2016，36(4): 123-127.
