Troubleshooting Low Temperature Adjusted Magnetron Sputtering Coating
In industrial production, magnetron sputtering is a widely used technique of coating, especially for vacuum-packed environment, due to its relatively low cost and environmental friendliness. However, troubleshooting of low temperature adjusted magnetron sputtering coating can be a difficult task if the parameters are not set properly. In this article, we will look into the principles of magnetron sputtering, the variables which affect sputtering operation, and the troubleshooting techniques used to detect and correct the faults.
What is Magnetron Sputtering?
Magnetron sputtering is the process of coating materials onto a substrate using a stream of high speed charged particles, known as ions, emitted from an electrically charged magnetron. It is a physical kind of vacuum possible technology. The particles that strike the substrate have enough energy to remove material from the target and also leave a thin layer of material on the substrate, providing a coating that meets various industrial requirements.
The aim of electrostatic sputtering is to ensure that the ionized particles arrive with sufficient energy to clean away contaminants from the substrate, whilst not damaging the surface of the substrate itself. In low temperature adjusted magnetron sputtering, the applied temperature is lower than that commonly used in sputter coating in order to increase the amount of ions available to the process while still keeping the process in safe operating parameters.
Variables Affecting Operation
The operation of low temperature adjusted magnetron sputtering depends on many variables. These variables can affect the size and uniformity of the coating, as well as the amount of material that is transferred from the target to the substrate. Some of the main variables are:
1. Power source – The power source supplies the energy that is used in sputter coating. It is important to ensure that the power source is not too powerful, or too weak, as this could lead to damaged coating or inadequate coverage.
2. Pressure – The pressure in the vacuum chamber needs to be correctly adjusted to ensure the proper mixture of ions and gas molecules, and to prevent damage to the coating.
3. Temperature – As already mentioned, the temperature needs to be reduced in order to increase the amount of ions available to the process. Too low temperatures can cause molecules to no longer be sputtered, while too high temperatures can damage the coating process.
Troubleshooting
In order to troubleshoot low temperature adjusted magnetron sputtering, it is important to identify the most common faults and to also understand the effects that can be caused by changes to the variables. One of the most common faults is related to the power source, as this can lead to poor coating and insufficient ion flows. This can be remedied by ensuring that the power source is operating at the correct voltage and current, and that it is not overloaded.
It is also important to ensure that the pressure in the chamber is not too low, or too high. Too low a pressure can cause the molecules in the chamber to not be energized enough to clean away contaminants from the substrate, while too high a pressure can cause damage to the substrate or the coating.
Finally, the temperature in the chamber needs to be closely monitored and adjusted according to the type of material that is being sputtered. Too low a temperature can cause insufficient ion flows, while too high a temperature can lead to unequal coating, or even damage to the substrate.
Conclusion
In conclusion, low temperature adjusted magnetron sputtering is a useful technique for coating substrates that require a low temperature operation. However, it is important to understand and be aware of the various variables that can affect the process. By monitoring the power source, pressure, and temperature, it is possible to troubleshoot and correct any faults that may occur.
