PCB punching quality and defect countermeasures

PCB punching quality and fault treatment strategies Introduction Printed circuit board (PCB) punching is a very important process in the manufacture of Printed Circuit Board (PCB) products. It is a process of punching small holes on the board according to a certain arrangement, so as to connect ......

PCB punching quality and fault treatment strategies

Introduction

Printed circuit board (PCB) punching is a very important process in the manufacture of Printed Circuit Board (PCB) products. It is a process of punching small holes on the board according to a certain arrangement, so as to connect different parts of the circuit. PCB punching is a very simple process, but in the actual operation, because of many factors, such as the quality of materials and the size and type of holes, the precision of punching can be affected, resulting in various defects on the surface of the printed circuit board and affecting the use effect.

Analysis of causes of fault

1. Quality of materials

The quality of printing board is too poor. When punching, the surface of the board is hollowed out and burrs are left around the bottom. The burrs are easy to be connected with the circuit by mistake, and the cutting surface is sharp and smooth, which may cause insulation and other safety problems. In addition, some inferior materials do not have good flexibility, especially when the size and shape of the holes are relatively special, so that these can cause inaccurate size deviation and shape distortion.

2. Size and type of holes

The size and type of the hole should also not be neglected. For example, if the hole size is too small or the hole type is too complicated, or the hole density is too high, it will cause great difficulty in punching and bursting. The hole size is too large, which may cause sloshing, open circuit and short circuit, and even detach from the printed circuit board due to vibration or thermal expansion and contraction.

3. Improper process set-up

At the same time, the wrong setting of process parameters also has a great impact on punching quality. Generally speaking, if the pressure is too small and the speed is too slow, it will cause the board to swing, resulting in insufficient opening and inaccurate size of the hole. On the contrary, if the pressure is too large and the speed is too fast, it will cause excessive burr or even tearing of the board. Therefore, the selection of reasonable parameters is one of the basic guarantee measures for punching accuracy.

Solution

1. Select good materials

Choose the right materials that meet the technical requirements and use them strictly according to the requirements. At the same time, try to use special materials with good flexibility and toughness, so as to ensure the reasonable size and accuracy of punched holes.

2. Reasonable hole size

For the selection of hole size, the reasonable hole size should be based on the actual demand. On the one hand, it should be scientific and reasonable, on the other hand, it should meet the requirements of process. It should not be too large or too small, otherwise it will have a certain impact on the quality of punching.

3. Search for defective parts

For the sampling inspection, if the detected parts can be accurately located, it is necessary to re-examine them one by one according to the size, quality, etc. of the defective parts, so as to accurately determine the collists that cause the defects and make necessary improvements.

Conclusion

PCB punching process quality is directly related to the safety, reliability and service life of PCB products. Therefore, in order to improve the quality of punching and reduce the occurrence of faults, we should pay attention to the selection of materials, the technological parameters of punching and the improvement of operation level, so as to ensure high-quality PCB punching process.

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