The Necessity of White Dot Along the Cleaved Crystal
The importance of cleaving a crystal cannot be underestimated, and it is a crucial step in growing and using semiconductor crystals. A crystal must be cleaved in order to create a thin film that could eventually be used for a variety of applications, including photonics and integrated circuits. In order for the cleaving to be successful, there must be a white dot along the crystalline cleavage plane, known as a white dot along the cleaved crystal (WDCC). This is an important factor to ensure the success of cleaving and the subsequent growing of crystal thin films.
So what is a white dot along the cleaved crystal? It is a small white spot or defect in the crystalline structure of the specimen, usually composed of iron oxide or other minerals. These white dots often appear around the edges of the cleaved surfaces, and they are visible to the naked eye. They are indicators of the cleaving process, and they can affect the quality of the end product in many ways.
A WDCC can indicate the presence of defects in the crystalline structure of the material, which can either increase the chances of failure during the cleaving process, or have a negative effect on the thin film growth process. For example, if there are too many white dots present, it can cause the thin film to be disconnected or to have mottle patches during the growth process. Additionally, a WDCC can help to identify the top and bottom surface of the crystal, and help to determine where the cleavage plane is located.
The presence of a WDCC can be used as an indicator for determining the quality of the crystalline material. If there is a very small number of white dots along the cleaved surface, or none at all, then it may be possible to conclude that the specimen is of high quality. On the other hand, if a large number of white dots are present, then it might be necessary to refine the material before proceeding to the thin film fabrication process.
In addition to providing a visual cue to the quality of the material, WDCC can also be used to ensure the correct location of the cleavage plane. This is especially important when performing a precision cleaving process. The presence of white marks along the cleaved surface can be viewed under a microscope, and can be used to ensure that the cleavage plane is located in the exact position desired. Without a clearly defined WDCC, it would be much more difficult to be accurate when cleaving in complex 3D structures.
In conclusion, it is clear that white dots along the cleaved crystal are invaluable when it comes to the cleaving and subsequent thin film fabrication process. Not only do they indicate the quality of the material, but they can also be used to locate the cleavage plane more accurately. It is therefore essential that any crystalline material being prepared for cleaving should be closely examined for the presence of white dots.
