Ultra-thin board CP cold welding technology
Introduction
Ultra-thin board CP cold welding technology has become a hot spot in the electronic product industry. It has been widely used in the production of high-precision electronic components. It is one of the advanced welding methods in the industry. The welding performance of the welding machine can be compared directly with the socket welding processing. The ultra-thin board CP cold welding technology has the characteristics of fast heat conduction, strong layer adhesion and can be applied to various micro-precision welding processes. The ultra-thin board CP cold welding process can not only save costs, but also improve the efficiency of welding.
Basic principle
The ultra-thin board CP cold welding technology is based on thermocompression welding, using a hot press head to press the ultra-thin boardCP layers under the action of temperature and pressure on the heating plate, so that the surface components of the ultra-thin boardCP complementary layers are molecularly tiled, thereby realizing welding. The heater only supplies enough heat energy to activate the flux and make it vaporize. CP cold welding technology enables ultra-thin and flexible layers of various materials to form reliable and difficult-to-break interlace structures similar to those of common welding processes.
Advantages
1. The ultra-thin board CP cold welding technology solves the technical problems of poor thermal conductivity and long thermal diffusion distance, and greatly reduces the risk of scrapping products.
2. The ultra-thin board CP cold welding technology has the characteristics of small size and light weight, which makes it more suitable for micro-precision welding.
3. Since the ultra-thin board CP cold welding technology does not need to rely on metallurgical bonding to complete welding, the welding loss and deformation of the components are very small, and the welding accuracy is higher.
4. The ultra-thin board CP cold welding technology does not require soldering. This technology has the characteristics of no soldering, no holes, no flux, no cleaning, and can reduce production costs and improve production efficiency.
Application Field
The ultra-thin board CP cold welding technology has many advantages and wide application range. It can be used to solve the welding problems of ultra-thin boardCP, memory card and chip in communication, communication, aircraft and automobile electronics, industrial control and household appliances. The product field is further expanded, and the range of application of ultra-thin board CP cold welding technology is further improved.
Conclusion
In conclusion, ultra-thin board CP cold welding technology can greatly reduce the risk of product scrapping, reduce production costs and improve production efficiency. It has higher welding accuracy and does not require soldering. It has wide application fields and is increasingly favored by the electronics industry. With the development of technology, more and more enterprises will use ultra-thin board CP cold welding technology in the future.
