Crack Formation after Thermal Cleaning
Introduction
Heat cleaning is a process in which, thermal energy is used to clean components or substrates. Thermal cleaners use a combination of high temperature, oxygen, and pressure. The process is useful for removing oil, grease, flux, and other contaminants usually found in manufacturing and industrial processes. Despite its usefulness and non-invasive nature, thermal cleaning can produce fractures and cracks in certain substrates, components, and materials. This paper will examine the crack formation after thermal cleaning.
Process of Heat Cleaning
Thermal cleaning is a process in which temperatures in excess of 800⁰C (1472F) are used to remove organic material from components without any direct contact. This process is often used as an alternative to chemical cleaning in cases when the substrate is not able to withstand the harsh chemicals used in chemical cleaning processes.
The process often involves the use of industrial ovens, heated in a recirculating air flow environment. Recirculation reduces the amount of air released, preventing the release of dangerous volatile organic compounds. Heat is usually applied to the substrate while recirculating oxygen to burn off the contaminants. Pressurized oxygen or oxygen enriched air is typically used to increase temperatures, reduce process time, and dissolve organic oils and grease. The components are exposed to the thermal energy and oxidization process until the unwanted organic material has been removed. This is usually followed by a cooling cycle to return the components to their original temperatures. The entire process usually takes 15 minutes to an hour.
Causes of Crack Formation
After heat cleaning, it is possible for cracks or fractures to form in certain components and substrates. This is due to the rapid thermal cycling, rapid heating and cooling, and sudden temperature changes. When a substrate is rapidly heated and cooled, it undergoes thermal stresses. These thermal stresses can cause the substrate to expand and contract, leading to cracking.
In addition, when high temperatures are used and the substrate is exposed to oxygen, oxidation can occur. Oxidation involves the release of electrons by burning off contaminants. As the substrate is cooled, this new layer of oxidized material can also cause cracking. This type of crack is referred to as thermal fatigue.
Other Causes of Cracking
Other than thermal cycling and oxidation, cracks can form in substrates due to a variety of other causes. These include corrosion, contamination, and the material properties of the substrate itself. For example, if the substrate is unstable at high temperatures or is prone to warping, it can cause cracks to form as the substrate cools. Similarly, if the substrate is contaminated with oils and greases, it can also provide stress points, leading to cracking. Lastly, if the substrate is exposed to too much oxygen during the thermal cleaning process, it can cause oxidation, which can also lead to cracking.
Conclusion
Cracking is a common issue caused by thermal cleaning. This is due to the rapid heating and cooling process, as well as exposure to oxygen, which can cause oxidation of the substrate. In addition, other causes such as corrosion, contamination, and material properties can also lead to cracking. It is important to be aware of these potential causes in order to prevent cracking during thermal cleaning processes.